TY  - JOUR
A1  - Dong, H 
A1  - Meininger, A 
A1  - Jiang, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Magnetic nanocomposite for potential ultrahigh frequency microelectronic application.
Y1  - 2007/04/25
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIAL
VL  - 36
IS  - 5
SP  - 593
EP  - 597
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K S
A1  - Wong, C P
T1  - Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules.
Y1  - 2007/02/26
N1  - R831489
JF  - APPLIED PHYSICS LETTERS
J1  - APPL PHYS LETT
VL  - 90
IS  - 9
SP  - 092102 (3 pp.)
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Hua, F 
A1  - Wong, C P
T1  - Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders.
Y1  - 2007/08/11
N1  - R831489
JF  - CHEMISTRY OF MATERIALS
J1  - CHEM MATER
VL  - 19
IS  - 18
SP  - 4482
EP  - 4485
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Zhu, L 
A1  - Moon, K 
A1  - Wong, C P
T1  - The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production.
Y1  - 2007/03/
N1  - R831489
JF  - CARBON
J1  - CARBON
VL  - 45
IS  - 3
SP  - 655
EP  - 661
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Xiao, F 
A1  - Wong, C P
T1  - Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy.
Y1  - 2007/01/15
N1  - R831489
JF  - JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY
VL  - 45
IS  - 2
SP  - 181
EP  - 190
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Yim, M J
A1  - Wong, C P
T1  - High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications.
Y1  - 2007/05/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 36
IS  - 5
SP  - 549
EP  - 554
ER  - 


TY  - JOUR
A1  - Yim, M J
A1  - Li, Y 
A1  - Moon, K S
A1  - Wong, C P
T1  - Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives.
Y1  - 2007/10/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 36
IS  - 10
SP  - 1341
EP  - 1347
ER  -